Product Comparison
Technical Specifications
Feature
General
Capacity
—
—
16 GB
8 GB
—
Memory
Form Factor
—
—
288-pin DIMM
288-pin DIMM
—
Speed
—
—
5600 MT/s (PC5-44800)
5600 MT/s (PC5-44800)
—
Technology
—
—
DDR5 SDRAM
DDR5 SDRAM
—
Features
Buffered memory type
Unregistered (unbuffered)
Registered (buffered)
Unregistered (unbuffered)
Unregistered (unbuffered)
Unregistered (unbuffered)
CAS latency
46
40
46
46
40
Component for
Laptop
PC/Server
PC
PC
Laptop
Cooling type
—
—
—
—
Heatsink
Country of origin
—
—
—
—
China, Taiwan
ECC
No
Yes
No
No
No
Intel Extreme Memory Profile (XMP)
—
—
—
—
Yes
Intel Extreme Memory Profile (XMP) version
—
—
—
—
3.0
Internal memory
8 GB
16 GB
16 GB
8 GB
32 GB
Internal memory type
DDR5
DDR5
—
—
DDR5
JEDEC standard
—
—
—
—
Yes
Lead plating
—
—
—
—
Gold
Memory clock speed
5600 MHz
4800 MHz
—
—
—
Memory data transfer rate
—
—
—
—
5600 MT/s
Memory form factor
262-pin SO-DIMM
288-pin DIMM
—
—
262-pin SO-DIMM
Memory layout (modules x size)
1 x 8 GB
1 x 16 GB
1 x 16 GB
1 x 8 GB
1 x 32 GB
Memory ranking
1
1
1
1
2
Memory voltage
1.1 V
1.1 V
1.1 V
1.1 V
1.1 V
Module configuration
—
—
—
—
4096M x 64
On-Die ECC
—
—
—
—
Yes
Programming power voltage (VPP)
—
—
—
—
1.8 V
Refresh row cycle time
—
—
—
—
295 ns
Row active time
—
—
—
—
28.56 ns
Row cycle time
—
—
—
—
48 ns
SPD profile
—
—
—
—
Yes
Weight & dimensions
Depth
—
—
—
—
69.6 mm
Height
—
—
—
—
30 mm
Weight
—
—
—
—
10 g
Width
—
—
—
—
3.8 mm
Logistics data
Master (outer) case gross weight
—
—
—
—
812.13 g
Master (outer) case height
—
—
—
—
61 mm
Master (outer) case length
—
—
—
—
311.1 mm
Master (outer) case width
—
—
—
—
196.8 mm
Products per master (outer) case
—
—
—
—
25 pc(s)
Operational conditions
Operating temperature (T-T)
—
—
—
—
0 - 85 °C
Storage temperature (T-T)
—
—
—
—
-55 - 100 °C
Packaging data
Package depth
—
—
—
—
14 mm
Package height
—
—
—
—
171.4 mm
Package weight
—
—
—
—
26.72 g
Package width
—
—
—
—
57.1 mm
Manufacturer Warranty
Service & Support
—
—
Limited lifetime warranty
Limited lifetime warranty
—