Product Comparison
Technical Specifications
Feature
General
Capacity
32 GB
—
—
32 GB
16 GB
Memory
Form Factor
260-pin SO-DIMM
—
—
262-pin SO-DIMM
260-pin SO-DIMM
Speed
3200 MT/s (PC4-25600)
—
—
5600 MT/s (PC5-44800)
3200 MT/s (PC4-25600)
Technology
DDR4 SDRAM
—
—
DDR5 SDRAM
DDR4 SDRAM
Features
Backlight
No
—
—
—
—
Buffered memory type
Unregistered (unbuffered)
Unregistered (unbuffered)
Unregistered (unbuffered)
Unregistered (unbuffered)
Unregistered (unbuffered)
CAS latency
20
38
46
46
22
Component for
Laptop
Laptop
Laptop
Laptop
Laptop
Cooling type
Heatsink
—
—
—
—
Country of origin
China, Taiwan
—
—
—
—
ECC
No
No
No
No
No
Intel Extreme Memory Profile (XMP)
Yes
—
—
—
—
Internal memory
32 GB
8 GB
8 GB
—
16 GB
Internal memory type
—
DDR5
DDR5
—
—
JEDEC standard
Yes
—
—
—
—
Memory clock speed
—
—
5600 MHz
—
—
Memory data transfer rate
3200 MT/s
4800 MT/s
—
—
—
Memory form factor
—
262-pin SO-DIMM
262-pin SO-DIMM
—
—
Memory layout (modules x size)
2 x 16 GB
1 x 8 GB
1 x 8 GB
1 x 32 GB
1 x 16 GB
Memory ranking
1
1
1
2
—
Memory voltage
1.2 V
1.1 V
1.1 V
1.1 V
1.2 V
Module configuration
2048M x 64
—
—
—
—
On-Die ECC
—
Yes
—
—
—
Programming power voltage (VPP)
2.5 V
—
—
—
—
Refresh row cycle time
350 ns
—
—
—
—
Row active time
26.25 ns
—
—
—
—
Row cycle time
45.75 ns
—
—
—
—
Weight & dimensions
Depth
69.6 mm
—
—
—
—
Height
30 mm
—
—
—
—
Weight
16.6 g
—
—
—
—
Width
3.8 mm
—
—
—
—
Logistics data
Harmonized System (HS) code
84733020
—
—
—
84733020
Master (outer) case gross weight
1.35 kg
—
—
—
—
Master (outer) case height
101.6 mm
—
—
—
—
Master (outer) case length
311.1 mm
—
—
—
—
Master (outer) case width
203.2 mm
—
—
—
—
Products per master (outer) case
25 pc(s)
—
—
—
—
Operational conditions
Operating temperature (T-T)
0 - 85 °C
—
—
—
—
Storage temperature (T-T)
-55 - 100 °C
—
—
—
—
Packaging data
Package depth
14 mm
—
—
—
—
Package height
171.4 mm
—
—
—
—
Package weight
45.6 g
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—
—
—
Package width
95.2 mm
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—
—
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