Compare HEWLETT PACKARD INCORPORATED IT Hardware
Comparing 5 products side-by-side — specifications, pricing and stock. Showing HEWLETT PACKARD INCORPORATED products in the IT Hardware category.
| Specification | |||||
|---|---|---|---|---|---|
| Processor | |||||
| Component for | Server/workstation | — | — | — | — |
| Cooler included | No | — | — | — | — |
| Number of QPI links | 3 | — | — | — | — |
| Package type | Box | — | — | — | — |
| Processor ARK ID | 120492 | — | — | — | — |
| Processor base frequency | 2.1 GHz | — | — | — | — |
| Processor boost frequency | 3.7 GHz | — | — | — | — |
| Processor cache | 22 MB | — | — | — | — |
| Processor cache type | L3 | — | — | — | — |
| Processor codename | Skylake | — | — | — | — |
| Processor cores | 16 | — | — | — | — |
| Processor family | Intel® Xeon® Gold | — | — | — | — |
| Processor generation | 1st Generation Intel® Xeon® Scalable | — | — | — | — |
| Processor lithography | 14 nm | — | — | — | — |
| Processor model | 6130 | — | — | — | — |
| Processor operating modes | 64-bit | — | — | — | — |
| Processor series | Intel Xeon Gold 6000 Series | — | — | — | — |
| Processor socket | LGA 3647 (Socket P) | — | — | — | — |
| Processor threads | 32 | — | — | — | — |
| Thermal Design Power (TDP) | 125 W | — | — | — | — |
| Memory | |||||
| ECC | Yes | — | — | — | — |
| Maximum internal memory supported by processor | 768 GB | — | — | — | — |
| Memory channels | Hepta-channel | — | — | — | — |
| Memory clock speeds supported by processor | 2666 MHz | — | — | — | — |
| Memory types supported by processor | DDR4-SDRAM | — | — | — | — |
| Graphics | |||||
| Discrete graphics card | No | — | — | — | — |
| Discrete graphics card model | Not available | — | — | — | — |
| On-board graphics card | No | — | — | — | — |
| On-board graphics card model | Not available | — | — | — | — |
| Processor special features | |||||
| AVX-512 Fused Multiply-Add (FMA) units | 2 | — | — | — | — |
| Conflict-Free processor | Yes | — | — | — | — |
| Enhanced Intel SpeedStep Technology | Yes | — | — | — | — |
| Intel 64 | Yes | — | — | — | — |
| Intel Trusted Execution Technology | Yes | — | — | — | — |
| Intel TSX-NI | Yes | — | — | — | — |
| Intel TSX-NI version | 1.00 | — | — | — | — |
| Intel Turbo Boost Max Technology 3.0 | No | — | — | — | — |
| Intel Virtualization Technology (VT-x) | Yes | — | — | — | — |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes | — | — | — | — |
| Intel VT-x with Extended Page Tables (EPT) | Yes | — | — | — | — |
| Intel® AES New Instructions (Intel® AES-NI) | Yes | — | — | — | — |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes | — | — | — | — |
| Intel® Optane™ Memory Ready | No | — | — | — | — |
| Intel® Speed Shift Technology | Yes | — | — | — | — |
| Intel® Turbo Boost Technology | 2.0 | — | — | — | — |
| Intel® vPro™ Platform Eligibility | Yes | — | — | — | — |
| Other features | |||||
| Core diameter | — | — | 5.08 cm | — | — |
| Master (outer) cases per pallet | — | 81 pc(s) | — | — | — |
| Printing material brightness | — | 89% | — | — | — |
| Printing material dry time | — | 0 min. | — | — | — |
| Printing material lamination | — | thermal, pressure-sensitive laminate films | — | — | — |
| Printing material opacity | — | 93% | — | — | — |
| Printing material waterfastness | — | Lamination required | — | — | — |
| Printing material whiteness | — | 145 | — | — | — |
| Printing media gloss level | — | Matte | — | — | — |
| Products per pallet | — | 99 pc(s) | — | — | — |
| Quantity per box | — | 1 pc(s) | — | — | — |
| Retail only | — | N | — | — | — |
| Roll length | — | — | 45.7 m | — | — |
| Roll width | — | — | 91.5 cm | — | — |
| Stacking number for pallet | — | 2 pc(s) | — | — | — |
| UNSPSC-code | — | 43212104 | — | — | — |
| Features | |||||
| Country of origin | — | Germany | — | — | — |
| Embedded options available | Yes | — | — | — | — |
| Execute Disable Bit | Yes | — | — | — | — |
| Finish type | — | — | Matte | — | — |
| HP segment | Business | — | — | — | — |
| Market segment | Server | — | — | — | — |
| Maximum number of PCI Express lanes | 48 | — | — | — | — |
| Media weight | — | — | 90 g/m² | — | — |
| Opacity | — | — | 94% | — | — |
| PCI Express slots version | 3.0 | — | — | — | — |
| Print media weight | — | 90 g/m² | — | — | — |
| Printing material shelf life | — | 2 year(s) | 2 year(s) | — | — |
| Printing media thickness | — | 115 µm | — | — | — |
| Product colour | — | — | White | — | — |
| Recommended usage | — | — | Inkjet printing | — | — |
| Roll length | — | 45.7 m | — | — | — |
| Scalability | S4S | — | — | — | — |
| Size (imperial) | — | 11.1 cm (4.38") | — | — | — |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 | — | — | — | — |
| Weight | — | 6.74 kg | — | — | — |
| Weight & dimensions | |||||
| Dimensions (WxDxH) | — | 111 x 1422 x 108 mm | — | — | — |
| Package depth | — | — | 108 mm | — | — |
| Package height | — | — | 965.2 mm | — | — |
| Package weight | — | — | 4.63 kg | — | — |
| Package width | — | — | 111.1 mm | — | — |
| Pallet dimensions (W x D x H) | — | 1257 x 1016 x 1435 mm | — | — | — |
| Pallet dimensions (W x D x H) (imperial) | — | 1016 x 1435.1 x 1257.3 mm (40 x 56.5 x 49.5") | — | — | — |
| Logistics data | |||||
| Harmonized System (HS) code | — | 48025590 | 84439990 | — | — |
| Pallet gross weight | — | 726 kg | — | — | — |
| Operational conditions | |||||
| Operating relative humidity (H-H) | — | 20 - 80% | 20 - 80% | — | — |
| Operating temperature (T-T) | — | 15 - 35 °C | 15 - 30 °C | — | — |
| Storage relative humidity (H-H) | — | 5 - 95% | 20 - 60% | — | — |
| Storage temperature (T-T) | — | 0 - 40 °C | 10 - 30 °C | — | — |
| Tcase | 87 °C | — | — | — | — |
| Packaging data | |||||
| Package dimensions (W x D x H) | — | 1422.4 x 111 x 108 mm (56 x 4.37 x 4.25") | — | — | — |
| Package dimensions (WxDxH) | — | 1422 x 111 x 108 mm | — | — | — |
| Package weight | — | 5.85 kg | — | — | — |
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