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16GB 3200MT/s DDR4 ECC CL22 DIMM 2Rx8 Hy

Manuf P/N: KSM32ED8/16HE

Kingston Technology KSM32ED8/16HE. Component for: Server, Internal memory: 16 GB, Memory layout (modules x size): 2 x 8 GB, Internal memory type: DDR4, Memory form factor: 288-pin DIMM, CAS latency: 22, ECC
  • VDDQ = 1.2V Typical
  • VPP = 2.5V Typical
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Data bus inversion (DBI) for data bus
  • Power Supply: VDD = 1.2V Typical
  • Terminated control command and address bus
  • PCB: Height 1.23” (31.25mm)
  • Low-power auto self refresh (LPASR)
  • Dual-rank
  • On-board I2 serial presence-detect (SPD) EEPROM
  • 16 internal banks; 4 groups of 4 banks each
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Fly-by topology
  • VDDSPD = 2.2V to 3.6V
  • RoHS Compliant and Halogen-Free
  • On-die VREFDQ generation and calibration
  • Temperature sensor with integrated SPD
  • Selectable BC4 or BL8 on-the-fly (OTF)

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Kingston Technology KSM32ED8/16HE, 16 GB, 2 x 8 GB, DDR4, 288-pin DIMM

Features

Internal memory
16 GB GB
Buffered memory type
Unregistered (unbuffered)
Module configuration
2048M x 72
SPD profile
Yes
Programming power voltage (VPP)
2.5 V V
JEDEC standard
Yes
Memory layout (modules x size)
2 x 8 GB GB
Internal memory type
DDR4
Memory form factor
288-pin DIMM
Memory channels
Dual-channel
Memory data transfer rate
3200 MT/s MT/s
Component for
Server
ECC
Yes
CAS latency
22
Memory ranking
2
Memory voltage
1.2 V V
Row cycle time
45.75 ns ns
Row active time
32 ns ns

Operational conditions

Storage temperature (T-T)
-55 - 100 °C °C
Operating temperature (T-T)
0 - 85 °C °C

Weight & dimensions

Width
133.3 mm mm
Height
31.2 mm mm

Sustainability

Compliance certificates
RoHS
16GB 3200MT/s DDR4 ECC CL22 DIMM 2Rx8 Hy — image 1
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