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16GB 3200MT/s DDR4 ECC CL22 SODIMM 2Rx8

Manuf P/N: KSM32SED8/16HE

Kingston Technology KSM32SED8/16HE. Component for: Server, Internal memory: 16 GB, Memory layout (modules x size): 1 x 16 GB, Internal memory type: DDR4, Memory form factor: 260-pin SO-DIMM, CAS latency: 22, ECC
  • Functionality and operations comply with the DDR4 SDRAM datasheet
  • On-Die Termination (ODT)
  • Temperature sensor with integrated SPD
  • This product is in compliance with the RoHS directive
  • Internal Vref DQ level generation is available
  • VPP = 2.5V
  • VDDSPD = 2.20V to 3.60V
  • Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600
  • Bi-Directional Differential Data Strobe
  • 8 bit pre-fetch
  • Power Supply: VDD = 1.2V
  • VDDQ = 1.2V
  • 16 internal banks
  • Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for the banks in the same or different bank group accesses are available
  • Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
  • Supports ECC error correction and detection
  • Per DRAM Addressability is supported
  • RoHS Compliant and Halogen-Free
  • Write CRC is supported at all speed grades
  • CA parity (Command/Address Parity) mode is supported

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Kingston Technology KSM32SED8/16HE, 16 GB, 1 x 16 GB, DDR4, 260-pin SO-DIMM

Features

Internal memory
16 GB GB
Memory voltage
1.2 V V
Row cycle time
45.75 ns ns
Memory layout (modules x size)
1 x 16 GB GB
Component for
Server
Memory form factor
260-pin SO-DIMM
CAS latency
22
Memory ranking
2
Row active time
32 ns ns
Module configuration
2048M x 72
Internal memory type
DDR4
Memory data transfer rate
3200 MT/s MT/s
ECC
Yes
Buffered memory type
Unregistered (unbuffered)
SPD profile
Yes
Programming power voltage (VPP)
2.5 V V
JEDEC standard
Yes

Operational conditions

Storage temperature (T-T)
-55 - 100 °C °C
Operating temperature (T-T)
0 - 85 °C °C

Sustainability

Compliance certificates
RoHS

Weight & dimensions

Width
69.6 mm mm
Depth
3.7 mm mm
Height
30 mm mm
16GB 3200MT/s DDR4 ECC CL22 SODIMM 2Rx8 — image 1
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