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16GB 3200MT/s DDR4 ECC Reg CL22 DIMM 2Rx

Manuf P/N: KSM32RD8/16HE

Kingston Technology KSM32RD8/16HE. Component for: Server, Internal memory: 16 GB, Memory layout (modules x size): 1 x 16 GB, Internal memory type: DDR4, Memory form factor: 288-pin DIMM, CAS latency: 22, ECC
  • 8 bit pre-fetch
  • Per DRAM Addressability is supported
  • Power Supply: VDD = 1.2V
  • VDDQ = 1.2V
  • Bi-Directional Differential Data Strobe
  • This product is in compliance with the RoHS directive
  • Write CRC is supported at all speed grades
  • Supports ECC error correction and detection
  • Temperature sensor with integrated SPD
  • CA parity (Command/Address Parity) mode is supported
  • VDDSPD = 2.41V to 2.75V
  • 16 internal banks
  • Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for
  • Internal Vref DQ level generation is available
  • VPP = 2.5V
  • Functionality and operations comply with the DDR4 SDRAM datasheet
  • the banks in the same or different bank group accesses are available
  • Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
  • On-Die Termination (ODT)
  • Data transfer rates: PC4-3200, PC4-2933, PC4-2666, PC4-2400, PC4-2133, PC4-1866, PC4-1600

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Kingston Technology KSM32RD8/16HE, 16 GB, 1 x 16 GB, DDR4, 288-pin DIMM

Features

Memory data transfer rate
3200 MT/s MT/s
SPD profile
Yes
JEDEC standard
Yes
Internal memory
16 GB GB
Row cycle time
45.75 ns ns
Row active time
32 ns ns
ECC
Yes
Buffered memory type
Registered (buffered)
Memory voltage
1.2 V V
Module configuration
2048M x 72
Programming power voltage (VPP)
2.5 V V
Memory layout (modules x size)
1 x 16 GB GB
Component for
Server
CAS latency
22
Memory ranking
2
Memory form factor
288-pin DIMM
Internal memory type
DDR4

Operational conditions

Operating temperature (T-T)
0 - 85 °C °C
Storage temperature (T-T)
-55 - 100 °C °C

Sustainability

Compliance certificates
RoHS

Weight & dimensions

Height
31.2 mm mm
Width
133.3 mm mm
16GB 3200MT/s DDR4 ECC Reg CL22 DIMM 2Rx — image 1
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