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8GB 3200MT/s DDR4 ECC CL22 DIMM 1Rx8 Hyn

Manuf P/N: KSM32ES8/8HE

Kingston Technology KSM32ES8/8HE. Component for: Server, Internal memory: 8 GB, Memory layout (modules x size): 1 x 8 GB, Internal memory type: DDR4, Memory form factor: 288-pin DIMM, CAS latency: 22, ECC
  • Power Supply: VDD = 1.2V Typical
  • VDDSPD = 2.2V to 3.6V
  • Data bus inversion (DBI) for data bus
  • On-die VREFDQ generation and calibration
  • Single-rank
  • Temperature sensor with integrated SPD
  • 16 internal banks; 4 groups of 4 banks each
  • Terminated control command and address bus
  • VDDQ = 1.2V Typical
  • VPP = 2.5V Typical
  • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals
  • Low-power auto self refresh (LPASR)
  • On-board I2 serial presence-detect (SPD) EEPROM
  • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS)
  • Selectable BC4 or BL8 on-the-fly (OTF)
  • Fly-by topology
  • PCB: Height 1.23” (31.25mm)
  • RoHS Compliant and Halogen-Free

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Kingston Technology KSM32ES8/8HE, 8 GB, 1 x 8 GB, DDR4, 288-pin DIMM

Features

Internal memory
8 GB GB
Memory layout (modules x size)
1 x 8 GB GB
Internal memory type
DDR4
Memory data transfer rate
3200 MT/s MT/s
Component for
Server
Memory form factor
288-pin DIMM
ECC
Yes
CAS latency
22
Buffered memory type
Unregistered (unbuffered)
Memory ranking
1
Memory voltage
1.2 V V
Row active time
32 ns ns
SPD profile
Yes
Programming power voltage (VPP)
2.5 V V
JEDEC standard
Yes
Module configuration
1024M x 72
Row cycle time
45.75 ns ns

Operational conditions

Operating temperature (T-T)
0 - 85 °C °C
Storage temperature (T-T)
-55 - 100 °C °C

Sustainability

Compliance certificates
RoHS

Weight & dimensions

Width
133.3 mm mm
Height
31.2 mm mm
8GB 3200MT/s DDR4 ECC CL22 DIMM 1Rx8 Hyn — image 1
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