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StarTech.com Thermal Paste, High Performance Thermal Paste, Re-sealable Syringes (1.5g), Metal Oxide Heat Sink Compound, CPU Thermal Paste, Thermal Glue, RoHS / CE - GPU Grease - Processor heatsink paste - for P/N: FAN1156PWM, FAN370PRO, FAN478, FANCSORB, FANDURONTB, FANP1003LD, FANP2SECC
- Thermal paste 1.93 W/m·K
- 0.12 °C/W 1.7 g/cm³
- Silver
Similar Products
Overview
StarTech.com Thermal Paste, Metal Oxide Compound, Re-sealable Syringe (1.5g), CPU Heat Sink Thermal Grease Paste
Specifications
Features
- Type
- Thermal paste
- Thermal conductivity
- 1.93 W/m·K
- Product colour
- Silver
- Thermal resistance
- 0.12 °C/W
- Specific gravity
- 1.7 g/cm³
- Operating temperature (T-T)
- -30 - 180 °C
Technical details
- Evaporation (@ 200°C/24h)
- 0.001%
- Bleed (@ 200°C/24h)
- 0.05%
- Compliance certificates
- RoHS
Weight & dimensions
- Width
- 20 mm
- Depth
- 67 mm
- Weight
- 4 g
Packaging data
- Package width
- 84 mm
- Package depth
- 151 mm
- Package height
- 25 mm
- Package weight
- 17 g
Logistics data
- Master (outer) case width
- 330 mm
- Master (outer) case length
- 430 mm
- Master (outer) case height
- 330 mm
- Products per master (outer) case
- 230 pc(s)




