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Z8G4 XEON 6130 2.1 2666 16C CPU2

Manuf P/N: 1XM68AA

HP Intel Xeon Gold 6130. Processor family: Intel® Xeon® Gold, Processor socket: LGA 3647 (Socket P), Processor lithography: 14 nm. Memory channels: Hexa-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, AVX 2.0, AVX-512, SSE4.2, Scalability: S4S. Package width: 399 mm, Package depth: 203 mm, Package height: 156 mm. Compatibility: Z8G4

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HP Intel Xeon Gold 6130, Intel® Xeon® Gold, LGA 3647 (Socket P), 14 nm, 2.1 GHz, 64-bit, 1st Generation Intel® Xeon® Scalable

Processor

Processor cores
16
Processor lithography
14 nm nm
Cooler included
No
Processor model
6130
Processor boost frequency
3.7 GHz GHz
Processor cache
22 MB MB
Processor family
Intel® Xeon® Gold
Processor socket
LGA 3647 (Socket P)
Processor base frequency
2.1 GHz GHz
Processor operating modes
64-bit
Processor generation
1st Generation Intel® Xeon® Scalable
Component for
Server/workstation
Processor series
Intel Xeon Gold 6000 Series
Processor threads
32
Processor cache type
L3
Thermal Design Power (TDP)
125 W W
Stepping
H0
Processor codename
Skylake

Memory

Memory channels
Hexa-channel
Maximum internal memory supported by processor
768 GB GB
ECC
Yes
Memory types supported by processor
DDR4-SDRAM
Memory clock speeds supported by processor
2666 MHz MHz

Features

Execute Disable Bit
Yes
Market segment
Server
Maximum number of PCI Express lanes
48
PCI Express slots version
3.0
Supported instruction sets
AVX, AVX 2.0, AVX-512, SSE4.2
Scalability
S4S
Embedded options available
Yes
HP segment
Business

Processor special features

Intel® Speed Shift Technology
Yes
Intel VT-x with Extended Page Tables (EPT)
Yes
Intel 64
Yes
Intel Virtualization Technology (VT-x)
Yes
Intel® Hyper Threading Technology (Intel® HT Technology)
Yes
Intel® Turbo Boost Technology
2.0
Intel® AES New Instructions (Intel® AES-NI)
Yes
Intel TSX-NI
Yes
Enhanced Intel SpeedStep Technology
Yes
Intel Trusted Execution Technology
Yes
Intel Virtualization Technology for Directed I/O (VT-d)
Yes
Intel Turbo Boost Max Technology 3.0
No
Intel® Optane™ Memory Ready
No
Intel® vPro™ Platform Eligibility
Yes

Packaging data

Package width
399 mm mm
Package depth
203 mm mm
Package height
156 mm mm

Graphics

On-board graphics card
No

Operational conditions

Tcase
87 °C °C

Other features

Compatibility
Z8G4
Z8G4 XEON 6130 2.1 2666 16C CPU2 — image 1
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